Skip to content
Silicon Showcase
CompaniesApplicationsTechnology AreasAbout
Submit Technology
Submit Technology
Silicon Showcase

Silicon Showcase™ is the global directory of semiconductor technologies, platforms and innovations from around the world.

  • Technologies
  • Technology Signals
  • Companies
  • Applications
  • Technology Areas
  • About Us
  • How It Works
  • Submit Technology
  • Contact Us
  • Privacy Policy
  • Terms of Use
  • Disclaimer

Explore

  • Technologies
  • Technology Signals
  • Companies
  • Applications
  • Technology Areas

About

  • About Us
  • How It Works
  • Submit Technology
  • Contact Us

Legal

  • Privacy Policy
  • Terms of Use
  • Disclaimer

© 2026 Silicon Showcase™. All rights reserved.

Explore. Compare. Innovate.

Silicon Showcase
CompaniesApplicationsTechnology AreasAbout
Submit Technology
Submit Technology
Silicon Showcase

Silicon Showcase™ is the global directory of semiconductor technologies, platforms and innovations from around the world.

  • Technologies
  • Technology Signals
  • Companies
  • Applications
  • Technology Areas
  • About Us
  • How It Works
  • Submit Technology
  • Contact Us
  • Privacy Policy
  • Terms of Use
  • Disclaimer

Explore

  • Technologies
  • Technology Signals
  • Companies
  • Applications
  • Technology Areas

About

  • About Us
  • How It Works
  • Submit Technology
  • Contact Us

Legal

  • Privacy Policy
  • Terms of Use
  • Disclaimer

© 2026 Silicon Showcase™. All rights reserved.

Explore. Compare. Innovate.

  1. Home
  2. /Technologies
  3. /Synopsys HBM Interface IP

HBM CONTROLLER, PHY

HBM controller, PHY and verification IP

DESCRIBED FOR AI

Described for AI and high-performance computing SoCs and multi-die designs

APPLICATIONS

AI & HPC · Data Center

Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.

HBM CONTROLLER, PHY

HBM controller, PHY and verification IP

DESCRIBED FOR AI

Described for AI and high-performance computing SoCs and multi-die designs

APPLICATIONS

AI & HPC · Data Center

Public source

Synopsys HBM Interface IP

Design & IP

Synopsys HBM interface IP is a publicly offered interface-IP solution for connecting high-bandwidth memory to SoCs and multi-die designs.

  • AI & HPC
  • Data Center
United StatesView Official Source (opens in a new tab)

Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.

Overview

Synopsys HBM interface IP is a high-bandwidth memory interface family including controller, PHY and verification IP for AI and high-performance computing SoCs. Distinct from UCIe die-to-die IP.

Official Synopsys pages describe a complete offering that includes controller IP, PHY IP and verification IP for HBM generations used in AI and high-performance computing. Named HBM2, HBM3 and HBM4 IP generations remain capabilities of this interface family rather than separate listings. This is memory-interface IP, not Universal Chiplet Interconnect Express die-to-die IP, which is listed separately. Process-node availability and data-rate options should be confirmed with Synopsys.

Capabilities

Key characteristics associated with this technology.

  • HBM controller, PHY and verification IP

  • Described for AI and high-performance computing SoCs and multi-die designs

  • HBM generation variants remain family capabilities, not separate listings

  • Distinct from Synopsys UCIe die-to-die IP, which is listed separately

Organization

Synopsys

United States

View organization

Official resources

  • HBM IP Solutions | Synopsyssynopsys.com (opens in a new tab)

Source & disclosure

Independent discovery listing. This profile was prepared from publicly available information published by the organization. For the latest and complete technical information, refer to the official company source.

Official source

synopsys.com (opens in a new tab)

Last source check

Aug 31, 2026

Notice something that needs updating?

Report a correction

Related Technologies

Explore other semiconductor technologies.

Design & IP

VS1111FESOC

Metering system-on-chip that Vervesemi describes as an analog front end integrated with a microcontroller for single-phase energy measurement.

IndustrialEnergyView Technology
Advanced Packaging

APTURA Thermo-Compression Bonding

Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.

AI & HPCData CenterView Technology
Materials & Substrates

Advanced IC Photomasks

Photronics advanced IC photomasks are lithography reticles for integrated circuits, not a foundry node and not FPD masks.

AutomotiveAI & HPCView Technology
Power Semiconductors

AlphaSGT

AlphaSGT is Alpha and Omega’s shielded-gate trench MOSFET technology, not a GaN HEMT and not a power-module substrate.

AI & HPCData CenterView Technology