Technology Area
Design platforms, semiconductor IP and related enablement for chip development.
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Technologies
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Companies
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Applications
Design and IP covers the software, methodologies and reusable circuit blocks used to create semiconductor devices. Electronic design automation, licensed IP, process design kits and chiplet interface standards support how chips are specified, verified and implemented.
Discover technologies, solutions and innovations in this area.
GUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
AI & HPCData CenterTelecommunicationsView Technology
Alchip’s 2nm Design Platform is an ASIC physical-design methodology for 2nm compute dies and chiplet packaging, not a foundry process node.
AI & HPCData CenterTelecommunicationsView Technology
Texas Instruments analog BCD (LBC) is TI’s bipolar-CMOS-DMOS process identity for foundational analog and power silicon, described in official TI manufacturing communications.
AutomotiveIndustrialConsumer Electronics+1View TechnologyKey application areas leveraging these technologies.
Technology area visuals are illustrative representations.
