2NM ASIC PHYSICAL-DESIGN
2nm ASIC physical-design methodology
2nm ASIC physical-design methodology
Chiplet and advanced-packaging design support
AI & HPC · Data Center · Telecommunications
Public source
2nm Design Platform is a publicly named Alchip ASIC design methodology.
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Illustrative representation based on publicly available technical information.
Alchip’s 2nm Design Platform is an ASIC physical-design methodology for 2nm compute dies and chiplet packaging, not a foundry process node.
Official Alchip newsroom materials from 22 July 2025 present first 2nm test-chip wafers, physical design for 2nm compute dies with 3nm/5nm IO chiplets, and support for CoWoS and SoIC packaging. The listing belongs in Design & IP because the published technology is a design platform, not a foundry process or a compute architecture. This listing records the 2nm design platform rather than every Alchip ASIC program. Packaging options should be confirmed on Alchip’s current public materials.
Key characteristics associated with this technology.
2nm ASIC physical-design methodology
Chiplet and advanced-packaging design support
Not a foundry process-node listing
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