Application
Accelerators, interconnect and packaging used in high-performance and AI computing.
95 technologies
Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
Photronics advanced IC photomasks are lithography reticles for integrated circuits, not a foundry node and not FPD masks.
AlphaSGT is Alpha and Omega’s shielded-gate trench MOSFET technology, not a GaN HEMT and not a power-module substrate.
QuickLogic Australis is embedded FPGA IP, not a standalone FPGA chip and not a foundry process.
CEVA-NeuPro-Nano is edge NPU processor IP, not a discrete accelerator chip and not a full SoC.
Cohu Diamondx is semiconductor ATE instrumentation, not a handler and not a probe card.
Aehr FOX-XP is a multi-wafer burn-in and test system, not a packaged-device ATE rack and not a probe card.
Arteris FlexNoC is on-chip network IP, not a packaged interconnect chip and not a coherent cache controller.
Micronics Japan MEMS-SP is a MEMS probe-card technology for wafer test, not a handler and not a packaged-device socket.
Ambiq SPOT is subthreshold MCU circuit technology, not a wireless protocol stack and not a foundry process.
Tekscend semiconductor photomasks are lithography reticles, not a foundry process node and not a mask writer.
centrotherm c.HORICOO 300 is a 300 mm horizontal furnace platform, not a deposition-materials consumable.
