Application
Accelerators, interconnect and packaging used in high-performance and AI computing.
95 technologies
GUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
Powerchip 3D AI Foundry is a wafer-on-wafer logic/memory stacking foundry offering, parked in Advanced Packaging because Foundry / Process does not yet exist.
Kokusai Batch ALD combines atomic-layer deposition with multi-wafer batch furnaces for 3D device films.
FormFactor composite-metal MEMS is a wafer-probe-card technology, not a MEMS sensor product.
Camtek Eagle is a wafer inspection and metrology equipment platform for BEOL, advanced packaging and related flows.
Qnity Emblem is a next-generation CMP pad platform for advanced-node planarization, not a polishing tool.
GlobalWafers Silicon Wafers are the company's silicon starting substrates, including annealed, epitaxial, SOI and diffusion wafers.
ASMPT LITHOBOLT G2 is a die-to-wafer hybrid-bonding system for direct and collective bonding.
Nova’s multidisciplinary metrology platform combines optical scatterometry, X-ray and materials analysis for process control.
SCREEN SU Series is a single-wafer cleaning equipment family, currently described through SU-3400.
SUMCO Advanced Silicon Wafers are polished and specialty silicon starting substrates, including epitaxial, annealed and SOI wafers.
VeriSilicon SiPaaS is a platform-based custom-silicon design and turnkey service, not a foundry process node.
