DIE-TO-WAFER HYBRID BONDING
Die-to-wafer hybrid bonding
Die-to-wafer hybrid bonding
Direct and collective bonding, as published for LITHOBOLT G2
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LITHOBOLT G2 is the hybrid-bonding generation published on ASMPT SEMI's product page.
Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.
ASMPT LITHOBOLT G2 is a die-to-wafer hybrid-bonding system for direct and collective bonding.
ASMPT describes direct and collective die-to-wafer hybrid bonding, with standalone and cascade configurations. This listing records LITHOBOLT G2.
Key characteristics associated with this technology.
Die-to-wafer hybrid bonding
Direct and collective bonding, as published for LITHOBOLT G2
Standalone and cascade configurations
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