Application
Semiconductor technologies used in vehicles, powertrain and driver-assistance systems.
84 technologies
Aheesa's Vihaan-I is a RISC-V networking SoC for fiber broadband. First-pass silicon was announced in 2026, with production tape-out targeted for 2027.
Photronics advanced IC photomasks are lithography reticles for integrated circuits, not a foundry node and not FPD masks.
Elmos automotive motor-control ICs are mixed-signal BLDC driver chips, parked in Design & IP because Analog / Mixed Signal does not exist.
Cohu Diamondx is semiconductor ATE instrumentation, not a handler and not a probe card.
Aehr FOX-XP is a multi-wafer burn-in and test system, not a packaged-device ATE rack and not a probe card.
Arteris FlexNoC is on-chip network IP, not a packaged interconnect chip and not a coherent cache controller.
Micronics Japan MEMS-SP is a MEMS probe-card technology for wafer test, not a handler and not a packaged-device socket.
Tekscend semiconductor photomasks are lithography reticles, not a foundry process node and not a mask writer.
MARUWA silicon-nitride substrates are ceramic power-module boards, not a silicon wafer and not a packaged MOSFET.
SEALSQ VaultIC is a secure-element chip family, not a software PKI service and not a wireless modem.
Weebit ReRAM is embedded resistive-RAM IP, not a discrete DRAM or NAND catalog.
centrotherm c.HORICOO 300 is a 300 mm horizontal furnace platform, not a deposition-materials consumable.
