Application
Accelerators, interconnect and packaging used in high-performance and AI computing.
95 technologies
DISCO DBG with DAF laser cut is a dicing-before-grinding process that laser-cuts die-attach film during wafer thinning.
Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.
HANMI Dual TC Bonder is a thermocompression bonding platform for HBM die stacking.
Astera Labs Intelligent Connectivity Platform is PCIe, CXL and Ethernet connectivity silicon for AI and data-center racks, not a compute accelerator architecture.
CXMT LPDDR6 is ChangXin Memory Technologies’ current low-power DRAM generation, described in official newsroom coverage of mass production for mobile and AI-adjacent platforms.
Cambricon MLUarch03 is the company’s published AI processor architecture for machine-learning accelerators.
NAURA’s plasma etch platform is a wafer-fabrication etch tool family published on NAURA’s official product pages.
AMEC Primo is a plasma etch equipment platform published on AMEC’s official product pages.
Renesas R-Car is an automotive system-on-chip platform for ADAS, cockpit and vehicle compute, not a standalone data-center accelerator architecture.
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
Advantest V93000 EXA Scale is a flagship SoC automatic test equipment platform for high-volume digital, mixed-signal and high-speed I/O devices.
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
