DICING-BEFORE-GRINDING WAFER PROCESS
Dicing-before-grinding wafer process
Dicing-before-grinding wafer process
Laser cut of die-attach film
Automotive · AI & HPC · Consumer Electronics
Public source
DBG + DAF Laser Cut is a publicly described DISCO dicing and grinding process.
Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.
DISCO DBG with DAF laser cut is a dicing-before-grinding process that laser-cuts die-attach film during wafer thinning.
Official DISCO solution pages present dicing before grinding combined with laser cutting of die-attach film. This listing records that named process rather than every DISCO dicer or grinder model. Process applicability should be confirmed on DISCO’s current solution pages.
Key characteristics associated with this technology.
Dicing-before-grinding wafer process
Laser cut of die-attach film
Process listing rather than a tool-SKU catalog
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