HYBRID-BONDING DIE-ATTACH EQUIPMENT
Hybrid-bonding die-attach equipment
Hybrid-bonding die-attach equipment
Named Datacon 8800 CHAMEO family
AI & HPC · Data Center · Consumer Electronics
Public source
Datacon 8800 CHAMEO Hybrid Bonding is a publicly named Besi assembly-equipment family.
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Illustrative representation based on publicly available technical information.
Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.
Official Besi hybrid-bonding pages present Datacon equipment for hybrid bonding in advanced packaging. This listing records the hybrid-bonding platform rather than every Besi die-attach tool. Process options should be confirmed on Besi’s current product pages.
Key characteristics associated with this technology.
Hybrid-bonding die-attach equipment
Named Datacon 8800 CHAMEO family
Advanced-packaging assembly rather than wafer etch
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