Technology Area
Heterogeneous integration, 2.5D/3D stacking, bonding and chiplet assembly approaches.
12
Technologies
8
Companies
4
Applications
Advanced packaging brings together multiple dies, chiplets and components into integrated systems, enabling higher performance, improved power efficiency and new form factors. It includes 2.5D/3D integration, interposers, hybrid bonding, chiplet ecosystems and heterogeneous integration approaches that extend beyond traditional scaling.
Discover technologies, solutions and innovations in this area.
3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.
AI & HPCData CenterConsumer ElectronicsView Technology
Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
AI & HPCData CenterConsumer ElectronicsView Technology
Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.
AI & HPCData CenterConsumer ElectronicsView TechnologyKey application areas leveraging these technologies.
Technology area visuals are illustrative representations.
