Application
Technologies supporting compute, networking, power and optical infrastructure.
90 technologies
Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
AlphaSGT is Alpha and Omega’s shielded-gate trench MOSFET technology, not a GaN HEMT and not a power-module substrate.
Arteris FlexNoC is on-chip network IP, not a packaged interconnect chip and not a coherent cache controller.
AXT VGF substrates are III-V wafers grown by vertical gradient freeze, not epiwafers and not finished RF chips.
GUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
Powerchip 3D AI Foundry is a wafer-on-wafer logic/memory stacking foundry offering, parked in Advanced Packaging because Foundry / Process does not yet exist.
Kokusai Batch ALD combines atomic-layer deposition with multi-wafer batch furnaces for 3D device films.
FormFactor composite-metal MEMS is a wafer-probe-card technology, not a MEMS sensor product.
Camtek Eagle is a wafer inspection and metrology equipment platform for BEOL, advanced packaging and related flows.
Rohm EcoGaN is a gallium-nitride power-device family, not a silicon MOSFET catalog.
Qnity Emblem is a next-generation CMP pad platform for advanced-node planarization, not a polishing tool.
Realtek Ethernet Total Solutions is a wired-connectivity PHY and controller platform, currently evidenced by live 2.5GbE product pages.
