Application
Technologies supporting compute, networking, power and optical infrastructure.
90 technologies
MACOM’s European Semiconductor Center publishes GaAs and GaN III-V foundry processes for microwave and mmWave devices.
Silergy’s integrated PMIC platform covers multi-rail power-management ICs, not discrete MOSFETs.
ASMPT LITHOBOLT G2 is a die-to-wafer hybrid-bonding system for direct and collective bonding.
SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
Nova’s multidisciplinary metrology platform combines optical scatterometry, X-ray and materials analysis for process control.
Aixtron Planetary Reactor is a batch MOCVD reactor architecture for compound-semiconductor epitaxy.
SUMCO Advanced Silicon Wafers are polished and specialty silicon starting substrates, including epitaxial, annealed and SOI wafers.
ACM Ultra C is a wet-clean and wet-process equipment family, not an IR homepage listing.
Alchip’s 2nm Design Platform is an ASIC physical-design methodology for 2nm compute dies and chiplet packaging, not a foundry process node.
The Dragonfly G5 System is Onto Innovation's advanced-packaging inspection and metrology system.
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
Coherent’s III-V epitaxial wafer platform supplies compound-semiconductor epi wafers for photonic and RF devices, not industrial laser systems.
