Application

Data Center

Technologies supporting compute, networking, power and optical infrastructure.

90 technologies

Technologies for Data Center

Advanced Packaging

SWIFT High-Density Fan-Out

Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.

AI & HPCData CenterConsumer Electronics+1View Technology

Memory & Storage

Second-generation 10nm-class DRAM

Nanya’s second-generation 10nm-class DRAM is the company’s current DRAM process generation, described in official investor communications.

AutomotiveData CenterConsumer ElectronicsView Technology

Foundry / Process

SiGe BiCMOS Platform

Tower Semiconductor SiGe BiCMOS is a specialty analog/RF foundry process combining silicon-germanium HBTs with CMOS.

AutomotiveData CenterTelecommunications+1View Technology

Test & Inspection

V93000 EXA Scale

Advantest V93000 EXA Scale is a flagship SoC automatic test equipment platform for high-volume digital, mixed-signal and high-speed I/O devices.

AutomotiveAI & HPCData Center+1View Technology

Advanced Packaging

VIPack

ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.

AI & HPCData CenterConsumer Electronics+1View Technology

Compute & Accelerators

Wafer-Scale Engine 3

Cerebras Wafer-Scale Engine 3 is a wafer-scale AI processor: one chip occupying an entire 300mm wafer for large-model training and inference.

AI & HPCData CenterView Technology

Advanced Packaging

AMD 3D V-Cache

3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.

AI & HPCData CenterConsumer ElectronicsView Technology

Compute & Accelerators

AMD Infinity Fabric

Infinity Fabric is AMD’s coherent on-package and multi-die interconnect, linking CPU core-complex dies to a central I/O die and, in multi-socket systems, across packages. Official EPYC architecture documents describe CCD–IOD GMI links and xGMI.

AI & HPCData CenterConsumer ElectronicsView Technology

Compute & Accelerators

AWS Trainium Machine Learning Silicon

Trainium is AWS’s custom machine-learning training silicon, built around NeuronCore and used in EC2 Trn instances. Official AWS silicon pages describe purpose-built ML chips as part of AWS custom silicon.

AI & HPCData CenterView Technology

Compute & Accelerators

Azure Maia 100

Azure Maia 100 is Microsoft's first in-house cloud AI accelerator: 105 billion transistors on 5 nm, for Azure training and inference.

AI & HPCData CenterView Technology

Photonics

Broadcom Co-Packaged Optics

Broadcom’s CPO platform heterogeneously integrates optical engines (TSMC COUPE) with Ethernet switch silicon. Tomahawk 6–Davisson is the third-generation CPO switch: 102.4 Tbps optically enabled capacity and a claimed reduction in optical-interconnect power versus pluggables.

AI & HPCData CenterTelecommunicationsView Technology

Connectivity & RF

Broadcom Tomahawk Ethernet Switch Silicon

Tomahawk is Broadcom’s Ethernet switch-ASIC family for data-center and AI fabrics. Tomahawk 6 is the current generation: 102.4 Tbps in a single chip, 100G/200G SerDes, and an optional co-packaged optics variant.

AI & HPCData CenterTelecommunicationsView Technology