Application
Technologies supporting compute, networking, power and optical infrastructure.
90 technologies
90 technologies
Lam Research SABRE is an electrochemical copper-deposition platform for damascene interconnect, including logic, memory and high-bandwidth memory wiring. Distinct from Lam’s broader etch category.
AI & HPCData CenterView Technology
Synopsys HBM interface IP is a high-bandwidth memory interface family including controller, PHY and verification IP for AI and high-performance computing SoCs. Distinct from UCIe die-to-die IP.
AI & HPCData CenterView Technology
Infineon OptiMOS is a low- and mid-voltage trench silicon MOSFET technology family for high-frequency power conversion. Distinct from CoolMOS, CoolSiC and CoolGaN.
AutomotiveData CenterIndustrial+1View Technology
KLA overlay and dimensional metrology systems measure layer-to-layer alignment, critical dimensions and related pattern geometry. Distinct from defect inspection and review.
AutomotiveData CenterConsumer ElectronicsView Technology
Applied Materials Endura is an ultra-high-vacuum metallization platform used for physical vapor deposition and integrated multi-chamber sequences. Distinct from the Vistara wafer-manufacturing chassis.
AI & HPCData CenterView Technology
NVIDIA NVLink is a high-bandwidth GPU-to-GPU interconnect and rack-scale fabric for AI training and inference. Distinct from NVLink-C2C chip-to-chip packaging links.
AI & HPCData CenterView Technology
Infineon CoolMOS is a high-voltage silicon superjunction MOSFET technology family for offline and high-voltage power conversion, distinct from CoolSiC, CoolGaN and OptiMOS.
Data CenterIndustrialConsumer Electronics+1View Technology
Intel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.
AI & HPCData CenterView Technology
TSMC-SoIC is a wafer-level frontend 3D chip-stacking platform for homogeneous and heterogeneous chiplets, distinct from CoWoS 2.5D packaging and InFO fan-out.
AI & HPCData CenterView Technology
TSMC CoWoS is a 2.5D advanced packaging platform that integrates logic dies and high-bandwidth memory on an interposer for high-performance computing and AI systems.
AI & HPCData CenterView Technology
FermionIC publishes multi-protocol SERDES semiconductor IP for high-speed chip-to-chip and system connectivity across advanced digital interfaces.
AI & HPCData CenterTelecommunicationsView Technology
Lightmatter Passage is a photonic interconnect platform using integrated photonics and three-dimensional connectivity approaches to scale high-bandwidth communication across advanced AI and computing systems.
AI & HPCData CenterView Technology
