ULTRA-HIGH-VACUUM PVD METALLIZATION
Ultra-high-vacuum PVD metallization platform
Ultra-high-vacuum PVD metallization platform
Multi-chamber sequences including preclean and integrated film stacks
AI & HPC · Data Center
Public source
Endura is Applied Materials’ publicly named ultra-high-vacuum metallization platform.
Official technology image
Applied Materials Endura is an ultra-high-vacuum metallization platform used for physical vapor deposition and integrated multi-chamber sequences. Distinct from the Vistara wafer-manufacturing chassis.
Official product pages describe Endura PVD as a multi-chamber system for depositing ultra-pure films used in front-end metallization, aluminum and copper interconnect, and related packaging metallization. The platform can host multiple process and preclean chambers for integrated sequences under vacuum. Endura is a metallization/PVD equipment platform, not the newer Vistara wafer-manufacturing chassis, which is listed separately. Chamber options, film stacks and performance data should be confirmed with Applied Materials.
Key characteristics associated with this technology.
Ultra-high-vacuum PVD metallization platform
Multi-chamber sequences including preclean and integrated film stacks
Described for front-end metallization, interconnect and packaging films
Distinct from the separately listed Vistara wafer-manufacturing platform
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