ELECTROCHEMICAL COPPER DEPOSITION
Electrochemical copper deposition for damascene interconnect
Electrochemical copper deposition for damascene interconnect
Described for logic interconnect, memory interconnect and high-bandwidth memory
AI & HPC · Data Center
Public source
SABRE is Lam Research’s publicly named electrochemical deposition family for copper interconnect.
Official technology image
Lam Research SABRE is an electrochemical copper-deposition platform for damascene interconnect, including logic, memory and high-bandwidth memory wiring. Distinct from Lam’s broader etch category.
Official product pages describe SABRE ECD as equipment for copper damascene manufacturing, addressing void-free fill, high-aspect-ratio structures and related logic and memory interconnect, including high-bandwidth memory. Named SABRE series remain tool SKUs of this ECD platform rather than separate listings. SABRE is a wet copper-deposition technology, not a synonym for Lam’s broader plasma etch and deposition category, which is listed separately. Process recipes and tool configurations should be confirmed on Lam’s current SABRE pages.
Key characteristics associated with this technology.
Electrochemical copper deposition for damascene interconnect
Described for logic interconnect, memory interconnect and high-bandwidth memory
Named SABRE series remain platform SKUs, not separate listings
Distinct from the broader Lam etch and deposition category listing
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