Application

Data Center

Technologies supporting compute, networking, power and optical infrastructure.

90 technologies

Technologies for Data Center

Test & Inspection

TPEG Vertical MEMS Probe Technology

Technoprobe TPEG Vertical MEMS is a named probe-card technology for wafer test, not a finished tester or a MEMS sensor product.

AutomotiveAI & HPCData CenterView Technology

Test & Inspection

ACTIS

Lasertec ACTIS is an actinic EUV photomask inspection platform for high-volume EUV mask qualification.

AI & HPCData CenterConsumer ElectronicsView Technology

Materials & Substrates

Advanced Deposition Materials Platform

Entegris Advanced Deposition Materials is a process-materials platform for precursor and deposition chemistries used in semiconductor manufacturing.

AutomotiveAI & HPCData Center+1View Technology

Manufacturing Equipment

CLEAN TRACK LITHIUS

Tokyo Electron CLEAN TRACK LITHIUS is a coater/developer track platform used with lithography tools in high-volume wafer fabrication.

AutomotiveAI & HPCData Center+1View Technology

Connectivity & RF

Credo SerDes

Credo SerDes is high-speed serializer/deserializer silicon and IP for data-center and AI interconnect, not a compute accelerator architecture.

AI & HPCData CenterTelecommunicationsView Technology

Advanced Packaging

Datacon 8800 CHAMEO Hybrid Bonding

Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.

AI & HPCData CenterConsumer ElectronicsView Technology

Advanced Packaging

Dual TC Bonder

HANMI Dual TC Bonder is a thermocompression bonding platform for HBM die stacking.

AI & HPCData CenterView Technology

Power Semiconductors

EliteSiC

onsemi EliteSiC is the company’s silicon-carbide power-device platform for traction, industrial and energy conversion.

AutomotiveData CenterIndustrial+1View Technology

Connectivity & RF

Intelligent Connectivity Platform

Astera Labs Intelligent Connectivity Platform is PCIe, CXL and Ethernet connectivity silicon for AI and data-center racks, not a compute accelerator architecture.

AI & HPCData CenterView Technology

Memory & Storage

LPDDR6

CXMT LPDDR6 is ChangXin Memory Technologies’ current low-power DRAM generation, described in official newsroom coverage of mass production for mobile and AI-adjacent platforms.

AI & HPCData CenterConsumer ElectronicsView Technology

Compute & Accelerators

MLUarch03

Cambricon MLUarch03 is the company’s published AI processor architecture for machine-learning accelerators.

AI & HPCData CenterView Technology

Manufacturing Equipment

Primo Etch Platform

AMEC Primo is a plasma etch equipment platform published on AMEC’s official product pages.

AI & HPCData CenterConsumer ElectronicsView Technology