COHERENT ON-PACKAGE INTERCONNECT
Coherent on-package interconnect between compute chiplets and an I/O die
Coherent on-package interconnect between compute chiplets and an I/O die
GMI links from Core Complex Dies to the central I/O die
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AMD Infinity Fabric is a publicly named coherent interconnect used to assemble chiplet CPUs.
Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.
Infinity Fabric is AMD’s coherent on-package and multi-die interconnect, linking CPU core-complex dies to a central I/O die and, in multi-socket systems, across packages. Official EPYC architecture documents describe CCD–IOD GMI links and xGMI.
Official AMD EPYC architecture documents describe Core Complex Dies connecting to a central I/O die over Global Memory Interconnect (GMI) links, with xGMI extending the fabric between sockets. This listing records the chiplet fabric rather than individual Zen or EPYC product generations. Arm Chiplet System Architecture, already listed, is an industry standard rather than AMD’s production fabric. NVIDIA NVLink is a GPU-scale interconnect, not this CPU/GPU chiplet fabric. Link rates and socket mappings should be confirmed on AMD’s current architecture documentation.
Key characteristics associated with this technology.
Coherent on-package interconnect between compute chiplets and an I/O die
GMI links from Core Complex Dies to the central I/O die
xGMI for multi-socket coherent connection
Distinct from Arm CSA, UCIe IP, NVLink and Intel EMIB
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