Company
United States
Semiconductor company that publishes chiplet CPU architectures and 3D cache stacking, including Infinity Fabric and 3D V-Cache.
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Technologies
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Technology Areas
3
Applications
United States
Headquarters
Key technologies and platforms from this organization.
3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.
AI & HPCData CenterView Details
Infinity Fabric is AMD’s coherent on-package and multi-die interconnect, linking CPU core-complex dies to a central I/O die and, in multi-socket systems, across packages. Official EPYC architecture documents describe CCD–IOD GMI links and xGMI.
AI & HPCData CenterView DetailsKey focus areas and application domains for this organization.
Key themes and trends derived from the published technologies of this organization on Silicon Showcase.
AMD 3D V-Cache is published in Advanced Packaging.
AMD Infinity Fabric is published in Compute & Accelerators.
Published technologies associated with AI & HPC and Consumer Electronics.
2 published technologies associated with Data Center.
