Technology Area
Compute architectures, AI accelerators, DPUs and high-bandwidth scale-up interconnects.
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Technologies
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Applications
Compute & Accelerators brings together semiconductor architectures and platforms for high-performance, AI, cloud and specialized computing — including accelerators, DPUs and high-bandwidth compute interconnects. Listings describe published architectures and fabrics rather than SKU catalogs or product rankings.
Discover technologies, solutions and innovations in this area.

Infinity Fabric is AMD’s coherent on-package and multi-die interconnect, linking CPU core-complex dies to a central I/O die and, in multi-socket systems, across packages. Official EPYC architecture documents describe CCD–IOD GMI links and xGMI.
AI & HPCData CenterConsumer ElectronicsView TechnologyTrainium is AWS’s custom machine-learning training silicon, built around NeuronCore and used in EC2 Trn instances. Official AWS silicon pages describe purpose-built ML chips as part of AWS custom silicon.
AI & HPCData CenterView TechnologyApple Silicon is Apple’s fabless SoC platform. The M1 newsroom introduction defines a system-on-chip with CPU, GPU, Neural Engine, I/O and unified memory on a single package so those engines share one memory pool.
AI & HPCConsumer ElectronicsView TechnologyKey application areas leveraging these technologies.
Technology area visuals are illustrative representations.