ETHERNET SWITCH ASIC
Ethernet switch ASIC platform for data-center and AI fabrics
Ethernet switch ASIC platform for data-center and AI fabrics
Current generation described at 102.4 Tbps with 100G/200G SerDes
AI & HPC · Data Center · Telecommunications
Public source
Broadcom Tomahawk is a publicly named Ethernet switch-ASIC platform for data-center and AI fabrics.
Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.
Tomahawk is Broadcom’s Ethernet switch-ASIC family for data-center and AI fabrics. Tomahawk 6 is the current generation: 102.4 Tbps in a single chip, 100G/200G SerDes, and an optional co-packaged optics variant.
Official Broadcom materials dated 3 June 2025 present Tomahawk 6 as 102.4 Tbps switching in a single chip with 100G/200G SerDes and an optional co-packaged optics variant; production-volume shipping was later announced on 12 March 2026. This listing records the switch-silicon platform rather than Tomahawk 4, 5 and 6 as three rows. Co-packaged optics is listed separately as a photonics technology. This is switch silicon, not a finished 1U switch or a telecom operator network. Bandwidth, SerDes and optics options should be confirmed on Broadcom’s current Tomahawk pages.
Key characteristics associated with this technology.
Ethernet switch ASIC platform for data-center and AI fabrics
Current generation described at 102.4 Tbps with 100G/200G SerDes
Optional co-packaged optics variant of the same switch family
Not a finished switch chassis or a separate Tomahawk 4/5 listing
Explore other semiconductor technologies.
NB-IoT system-on-chip that WiSig Networks describes as a 3GPP-compliant device with satellite non-terrestrial-network support and edge AI.
TelecommunicationsIoTView Technology
Saankhya Labs' Pruthvi-3 is a software-defined radio chipset series spanning baseband, mobile-receiver and modulator devices.
TelecommunicationsIoTView Technology
Aheesa's Vihaan-I is a RISC-V networking SoC for fiber broadband. First-pass silicon was announced in 2026, with production tape-out targeted for 2027.
AutomotiveIndustrialView Technology
Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
AI & HPCData CenterView Technology
