HIGH-DENSITY IC BUILD-UP
High-density IC build-up substrates
High-density IC build-up substrates
Flip-chip interconnect to system boards
Automotive · AI & HPC · Data Center · +1
Public source
High-Performance IC Substrate Platform is a publicly named AT&S materials offering.
Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
Official AT&S IC-substrate pages describe high-density build-up substrates, flip-chip interconnect and fine-line copper for processors used in AI, data-center and automotive systems. This listing records IC substrates rather than AT&S printed-circuit-board businesses. Linewidth and glass-core development claims should be taken from AT&S’s current substrate pages.
Key characteristics associated with this technology.
High-density IC build-up substrates
Flip-chip interconnect to system boards
Not a generic PCB or OSAT assembly listing
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