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Silicon Showcase
CompaniesApplicationsTechnology AreasAbout
Submit Technology
Submit Technology
Silicon Showcase

Silicon Showcase™ is the global directory of semiconductor technologies, platforms and innovations from around the world.

  • Technologies
  • Technology Signals
  • Companies
  • Applications
  • Technology Areas
  • About Us
  • How It Works
  • Submit Technology
  • Contact Us
  • Privacy Policy
  • Terms of Use
  • Disclaimer

Explore

  • Technologies
  • Technology Signals
  • Companies
  • Applications
  • Technology Areas

About

  • About Us
  • How It Works
  • Submit Technology
  • Contact Us

Legal

  • Privacy Policy
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  • Disclaimer

© 2026 Silicon Showcase™. All rights reserved.

Explore. Compare. Innovate.

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  3. /AT&S

Company

AT&S

Austria

IC-substrate company that publishes high-density build-up substrates used to connect advanced processors to system boards.

  • Materials & Substrates
  • Automotive
  • AI & HPC
  • Data Center
  • Telecommunications
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Source & Disclosure

Independent discovery listing based on publicly available information published by the organization.

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1

Technologies

1

Technology Areas

4

Applications

Austria

Headquarters

Technologies (1)

Key technologies and platforms from this organization.

Materials & Substrates

High-Performance IC Substrate Platform

AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.

AutomotiveAI & HPC+2View Details

Technology Footprint

Key focus areas and application domains for this organization.

Technology Areas (1)

  • Materials & Substrates

Applications (4)

  • Automotive
  • AI & HPC
  • Data Center
  • Telecommunications

Technology Signals

Key themes and trends derived from the published technologies of this organization on Silicon Showcase.

  • Materials & Substrates

    High-Performance IC Substrate Platform is published in Materials & Substrates.

  • AI & HPC and Automotive

    Published technologies associated with AI & HPC and Automotive.

  • Data Center & Telecommunications

    Published technologies associated with Data Center and Telecommunications.