Technology Area
Wafers, substrates, process materials and related material platforms.
13
Technologies
13
Companies
9
Applications
Materials and substrates are the wafers, films and package bases on which semiconductor devices are built. The area includes silicon and compound-semiconductor wafers, epitaxial layers, dielectrics and metals, and organic or ceramic package substrates used in fabrication and assembly.
Discover technologies, solutions and innovations in this area.
Entegris Advanced Deposition Materials is a process-materials platform for precursor and deposition chemistries used in semiconductor manufacturing.
AutomotiveAI & HPCData Center+1View Technology
Photronics advanced IC photomasks are lithography reticles for integrated circuits, not a foundry node and not FPD masks.
AutomotiveAI & HPCConsumer ElectronicsView Technology
Qnity Emblem is a next-generation CMP pad platform for advanced-node planarization, not a polishing tool.
AI & HPCData CenterConsumer ElectronicsView TechnologyKey application areas leveraging these technologies.
Technology area visuals are illustrative representations.
