ADVANCED-PACKAGING INSPECTION AND
Advanced-packaging inspection and 3D metrology
Advanced-packaging inspection and 3D metrology
Latest Dragonfly generation published as the G5 System
Automotive · AI & HPC · Data Center
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Dragonfly G5 System is the inspection and metrology system Onto Innovation publishes for advanced packaging.
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The Dragonfly G5 System is Onto Innovation's advanced-packaging inspection and metrology system.
Onto describes it as the latest generation in the Dragonfly series, with high-speed 2D imaging, multi-angle illumination, infrared imaging for bonded wafers, and 3D bump-height metrology. Applications on the official page include hybrid bonding, redistribution layers, pad CMP, TSV reveal and microbumps. This listing records the Dragonfly G5 System.
Key characteristics associated with this technology.
Advanced-packaging inspection and 3D metrology
Latest Dragonfly generation published as the G5 System
Hybrid bonding, RDL, pad CMP, TSV reveal and microbumps
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