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2.5D/3D multi-die ASIC design platform
2.5D/3D multi-die ASIC design platform
Advanced-packaging design rather than OSAT assembly
AI & HPC · Data Center · Telecommunications
Public source
2.5D/3D Multi-die Advanced Packaging Technology Platform is a publicly named GUC ASIC service covering CoWoS, InFO, SoIC and related multi-die design.
Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.
GUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
Official GUC APT materials describe IP, SI/PI co-simulation and manufacturing handoff for AI, HPC and networking ASICs. The listing belongs in Design & IP because the published offering is an ASIC design platform. This listing records APT rather than every GUC case study.
Key characteristics associated with this technology.
2.5D/3D multi-die ASIC design platform
Advanced-packaging design rather than OSAT assembly
Not a foundry process-node listing
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