Application

AI & HPC

Accelerators, interconnect and packaging used in high-performance and AI computing.

95 technologies

Technologies for AI & HPC

Photonics

Ayar Labs TeraPHY Optical I/O Chiplet

Ayar Labs TeraPHY is an optical I/O chiplet that combines silicon photonics with CMOS technology to provide high-bandwidth, low-latency chip-to-chip and package-to-package connectivity for large-scale computing systems.

AI & HPCData CenterTelecommunicationsView Technology

Design & IP

Arm Chiplet System Architecture

Arm Chiplet System Architecture provides standardized system partitioning and connectivity foundations for reusable chiplet-based designs. It is an architecture, not a processor-core catalog.

AutomotiveAI & HPCData CenterView Technology

Manufacturing Equipment

ASM Atomic Layer Deposition (ALD)

ASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.

AI & HPCData CenterConsumer ElectronicsView Technology

Compute & Accelerators

NVIDIA NVLink-C2C

NVIDIA NVLink-C2C is a high-bandwidth coherent chip-to-chip interconnect for processors, accelerators and custom silicon inside a package. Distinct from NVLink GPU-to-GPU fabric.

AI & HPCData CenterView Technology

Memory & Storage

Micron High-Bandwidth Memory (HBM)

Micron high-bandwidth memory technology uses vertically stacked DRAM dies and high-density interconnects to provide high memory bandwidth and power efficiency for AI and data-center computing platforms.

AI & HPCData CenterView Technology

Design & IP

Cadence Integrity 3D-IC Platform

Cadence design platform for planning, implementing and analyzing 2.5D and 3D multi-die / chiplet systems.

AutomotiveAI & HPCData CenterView Technology

Design & IP

Synopsys UCIe IP

Synopsys die-to-die IP solution for Universal Chiplet Interconnect Express, including controller, PHY and verification IP.

AutomotiveAI & HPCData CenterView Technology

Manufacturing Equipment

Applied Materials Vistara

Modular semiconductor wafer-manufacturing chassis from Applied Materials for combining multiple chamber types on one system. Distinct from the Endura metallization platform.

AI & HPCData CenterView Technology

Manufacturing Equipment

ASML TWINSCAN EXE High-NA EUV

ASML High-NA EUV lithography platform (TWINSCAN EXE) using 0.55 numerical aperture optics. Distinct from 0.33 NA TWINSCAN NXE EUV systems.

AI & HPCConsumer ElectronicsView Technology

Advanced Packaging

TSMC 3DFabric

TSMC umbrella family of 3D silicon stacking and advanced packaging. CoWoS, TSMC-SoIC and InFO are constituent platforms listed separately.

AI & HPCData CenterView Technology

Advanced Packaging

Intel Foveros

Intel Foundry 3D stacking and 2.5D chiplet packaging family, including hybrid-bonding options described as Foveros Direct 3D. EMIB is a separate 2.5D bridge platform.

AI & HPCData CenterConsumer ElectronicsView Technology