UNIFIED PLANNING, IMPLEMENTATION
Unified planning, implementation and signoff for 2.5D and 3D-IC designs
Unified planning, implementation and signoff for 2.5D and 3D-IC designs
Described for multi-chiplet and stacked-die systems
Automotive · AI & HPC · Data Center
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The Cadence Integrity 3D-IC Platform is a publicly named software environment for multi-die semiconductor design.
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Illustrative representation based on publicly available technical information.
Cadence design platform for planning, implementing and analyzing 2.5D and 3D multi-die / chiplet systems.
Official Cadence pages describe unified system-level planning, implementation and signoff for 2.5D and 3D stacked-die configurations, including chiplet integration. The platform is presented as working with Cadence digital, analog and packaging tools so teams can analyze thermal, electrical and related system effects. This independent listing summarizes the named design platform. License options, foundry support and analysis coverage should be confirmed with Cadence.
Key characteristics associated with this technology.
Unified planning, implementation and signoff for 2.5D and 3D-IC designs
Described for multi-chiplet and stacked-die systems
Integrates with Cadence digital, analog and packaging design tools
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