SURFACE-CONTROLLED LAYER-BY-LAYER THIN-FILM
Surface-controlled layer-by-layer thin-film deposition
Surface-controlled layer-by-layer thin-film deposition
Ultrathin conformal films for logic, memory and packaging
AI & HPC · Data Center · Consumer Electronics
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ASM publishes atomic layer deposition equipment and process technology for semiconductor manufacturing.
Official technology image
ASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.
Official pages describe ALD as a surface-controlled, layer-by-layer method that deposits ultrathin conformal films by alternating precursor and reactant pulses. ASM presents thermal ALD and plasma-enhanced ALD for advanced logic, memory and packaging structures, including high-k dielectrics and related film applications. This independent listing identifies the named ALD technology category rather than individual tool models. Process recipes, film stacks and tool configurations should be confirmed on ASM's current ALD pages.
Key characteristics associated with this technology.
Surface-controlled layer-by-layer thin-film deposition
Ultrathin conformal films for logic, memory and packaging
Thermal ALD and plasma-enhanced ALD process options described by ASM
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