UMBRELLA FAMILY COVERING
Umbrella family covering 3D silicon stacking and advanced packaging
Umbrella family covering 3D silicon stacking and advanced packaging
Officially groups TSMC-SoIC, CoWoS and InFO as constituent platforms
AI & HPC · Data Center
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TSMC 3DFabric is TSMC’s named family of 3D silicon stacking and advanced packaging, grouping frontend stacking and backend packaging used to assemble systems of smaller chips rather than a single large monolithic die.
Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.
TSMC umbrella family of 3D silicon stacking and advanced packaging. CoWoS, TSMC-SoIC and InFO are constituent platforms listed separately.
Official 3DFabric pages name TSMC-SoIC, CoWoS and InFO as the constituent solutions for homogeneous and heterogeneous integration in high-performance compute and related designs. This listing is the family umbrella. CoWoS, TSMC-SoIC and InFO are independent Silicon Showcase listings. Interposer or fan-out variants such as CoWoS-S, CoWoS-L, CoWoS-R and InFO-PoP remain capabilities of those platforms, not separate listings. Foundry process details, design kits and service options remain with TSMC.
Key characteristics associated with this technology.
Umbrella family covering 3D silicon stacking and advanced packaging
Officially groups TSMC-SoIC, CoWoS and InFO as constituent platforms
Described for homogeneous and heterogeneous chip integration
Does not replace the separate CoWoS, TSMC-SoIC and InFO listings
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