Company
TaiwanHsinchu (HQ)
Dedicated semiconductor foundry headquartered in Hsinchu, Taiwan, offering wafer manufacturing plus publicly described 3D stacking and advanced packaging services.
4
Technologies
1
Technology Areas
4
Applications
Taiwan
Headquarters
Key technologies and platforms from this organization.
TSMC InFO is a wafer-level integrated fan-out packaging platform using high-density redistribution layers for mobile, network and high-performance computing integration.
AI & HPCConsumer ElectronicsView Details
TSMC-SoIC is a wafer-level frontend 3D chip-stacking platform for homogeneous and heterogeneous chiplets, distinct from CoWoS 2.5D packaging and InFO fan-out.
AI & HPCData CenterView Details
TSMC CoWoS is a 2.5D advanced packaging platform that integrates logic dies and high-bandwidth memory on an interposer for high-performance computing and AI systems.
AI & HPCData CenterView Details
TSMC umbrella family of 3D silicon stacking and advanced packaging. CoWoS, TSMC-SoIC and InFO are constituent platforms listed separately.
AI & HPCData CenterView DetailsKey focus areas and application domains for this organization.
Key themes and trends derived from the published technologies of this organization on Silicon Showcase.
4 published technologies in Advanced Packaging.
Published technologies associated with AI & HPC and Data Center.
Published technologies associated with Consumer Electronics and Telecommunications.
