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0.33 NA EUV lithography platform using 13.5 nm light
0.33 NA EUV lithography platform using 13.5 nm light
Described for high-volume manufacturing of advanced logic and memory nodes
AI & HPC · Consumer Electronics
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ASML TWINSCAN NXE systems are the company’s 0.33 numerical-aperture extreme ultraviolet lithography platform.
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ASML TWINSCAN NXE is the 0.33 numerical-aperture EUV lithography platform used in high-volume manufacturing of advanced logic and memory chips. Distinct from High-NA EXE systems.
Official EUV product pages describe NXE tools as 13.5 nm scanners used in high-volume manufacturing of advanced logic and memory, including foundation layers of 7 nm, 5 nm and 3 nm nodes. Named models such as NXE:3800E, NXE:3600D and NXE:3400C are scanner SKUs of this platform, not separate listings. NXE is distinct from TWINSCAN EXE High-NA (0.55 NA) EUV, which is listed separately, and from TWINSCAN DUV systems that print remaining chip layers. Throughput and overlay figures should be taken only from ASML’s current product documentation.
Key characteristics associated with this technology.
0.33 NA EUV lithography platform using 13.5 nm light
Described for high-volume manufacturing of advanced logic and memory nodes
Named NXE scanner models remain SKUs of this platform, not separate listings
Distinct from High-NA TWINSCAN EXE EUV and from TWINSCAN DUV
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