ASML TWINSCAN DUV Lithography

ASML TWINSCAN DUV is the deep-ultraviolet lithography platform covering immersion and dry scanners that print most chip layers alongside EUV. Distinct from NXE and High-NA EXE EUV.

Official DUV product pages describe immersion ArF tools as high-volume workhorses for advanced logic and memory, and dry ArF, KrF and i-line tools for remaining layers that do not require EUV. Individual NXT and XT scanner models are SKUs of this platform, not separate listings. ASML states that EUV prints the most intricate layers while DUV prints the rest, and that both will be required in parallel for many years. This listing is distinct from TWINSCAN NXE EUV and from High-NA EXE. Overlay, throughput and node claims should be taken from ASML’s current DUV documentation.