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United Microelectronics CorporationTaiwanView Technology

22ULP/ULL

UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.

Providers

Companies shown here publish a technology mapped to this page. Contact is for general enquiries, not a compatibility claim.

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28nm HKMG Process

SMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.

SMICChinaView Technology

Powerchip Semiconductor ManufacturingTaiwanView Technology

3D AI Foundry

Powerchip 3D AI Foundry is a wafer-on-wafer logic/memory stacking foundry offering, parked in Advanced Packaging because Foundry / Process does not yet exist.

Advanced Micro DevicesUnited StatesView Technology

AMD 3D V-Cache

3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.

Kulicke & Soffa IndustriesSingaporeView Technology

APTURA Thermo-Compression Bonding

Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.

Vanguard International SemiconductorTaiwanView Technology

BCD / UHV / SOI Foundry Platform

Vanguard BCD, UHV and SOI are specialty foundry process platforms for power management, parked in Power pending Foundry / Process.

BE Semiconductor IndustriesNetherlandsView Technology

Datacon 8800 CHAMEO Hybrid Bonding

Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.

HANMI SemiconductorSouth KoreaView Technology

Dual TC Bonder

HANMI Dual TC Bonder is a thermocompression bonding platform for HBM die stacking.

QorvoUnited StatesView Technology

Elite360 GaN & GaAs Foundry

Qorvo Elite360 is a GaN and GaAs foundry-services platform, parked in Design & IP because Foundry / Process does not yet exist.

Hua Hong SemiconductorChinaView Technology

Embedded Memory Process Platform

Hua Hong’s embedded memory process platform is a specialty foundry offering for embedded non-volatile memory on logic processes.

onsemiUnited StatesView Technology

Embedded Power Platform (EPP)

onsemi Embedded Power Platform (EPP) is a newly introduced wafer-level power-device integration architecture that uses the silicon wafer as the package. Sampling is expected in 2026 with strategic customers.

GlobalFoundriesUnited StatesView Technology

GlobalFoundries 22FDX FD-SOI

22FDX is GlobalFoundries’ 22 nm fully depleted SOI platform: a thin-body transistor on an insulating layer, targeting low-power, RF, automotive and IoT designs that do not need leading-edge GAA.

MACOM Technology SolutionsUnited StatesView Technology

III-V Foundry Process Platform

MACOM’s European Semiconductor Center publishes GaAs and GaN III-V foundry processes for microwave and mmWave devices.

Intel CorporationUnited StatesView Technology

Intel EMIB Advanced Packaging

Intel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.

Intel CorporationUnited StatesView Technology

Intel Foveros

Intel Foundry 3D stacking and 2.5D chiplet packaging family, including hybrid-bonding options described as Foveros Direct 3D. EMIB is a separate 2.5D bridge platform.

SkyWater TechnologyUnited StatesView Technology

RH90

SkyWater RH90 is a radiation-hardened 90 nm CMOS foundry process, not processor IP and not a packaged rad-hard MCU.

Amkor TechnologyUnited StatesView Technology

SWIFT High-Density Fan-Out

Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.

Samsung SemiconductorSouth KoreaView Technology

Samsung GAA MBCFET Process

Samsung’s 3 nm foundry node introduced Gate-All-Around transistors as Multi-Bridge-Channel FETs (MBCFET): stacked nanosheet channels with the gate on all four sides, replacing FinFET for better electrostatic control.

Tower SemiconductorIsraelView Technology

SiGe BiCMOS Platform

Tower Semiconductor SiGe BiCMOS is a specialty analog/RF foundry process combining silicon-germanium HBTs with CMOS.

TSMC 3DFabric

TSMC umbrella family of 3D silicon stacking and advanced packaging. CoWoS, TSMC-SoIC and InFO are constituent platforms listed separately.

TSMC CoWoS Advanced Packaging

TSMC CoWoS is a 2.5D advanced packaging platform that integrates logic dies and high-bandwidth memory on an interposer for high-performance computing and AI systems.

TSMC InFO Advanced Packaging

TSMC InFO is a wafer-level integrated fan-out packaging platform using high-density redistribution layers for mobile, network and high-performance computing integration.

TSMC SoIC 3D Integration

TSMC-SoIC is a wafer-level frontend 3D chip-stacking platform for homogeneous and heterogeneous chiplets, distinct from CoWoS 2.5D packaging and InFO fan-out.