Embedded Power Platform (EPP)

onsemi Embedded Power Platform (EPP) is a newly introduced wafer-level power-device integration architecture that uses the silicon wafer as the package. Sampling is expected in 2026 with strategic customers.

Unlike traditional power modules, EPP embeds multiple semiconductor die in a silicon wafer-level architecture and replaces wire bonds with wafer-level redistribution layers (RDLs). onsemi says the platform brings power, control and isolation functions together, and supports current and future generations of silicon, silicon carbide (SiC), gallium nitride (GaN) and emerging power technologies. The technology page states that co-optimized design delivers up to 4× improved power density. onsemi’s introduction also describes using the silicon wafer itself as the foundation of the package, 12-inch wafer manufacturing, and application figures that include 3–5× higher power density depending on the application; an early EPP-based solid-state circuit-breaker design described as about 50% smaller and 20% cooler; and traction-inverter figures of up to 4× higher power density and 15% lower power losses versus conventional approaches. Published application areas on the technology page are AI infrastructure, electric vehicles, charging infrastructure, renewable energy and industrial automation. Subaru is named as an early engagement partner evaluating the platform for future electrified vehicles. Availability: EPP is expected to begin sampling in 2026 with strategic customers and ecosystem participants across automotive and AI applications. This listing does not describe EPP as a generally available production catalog.