310 × 310
310 × 310 mm panel-level packaging platform
310 × 310 mm panel-level packaging platform
Integrates temporary carrier bonding, debonding and detaping
AI & HPC · Data Center
Public source
ERS electronic announced a fully automated panel-level packaging (PLP) system for 310 × 310 mm substrates on its official automated-PLP page.
Official technology image
Fully automated 310 × 310 mm panel-level packaging system from ERS electronic that integrates temporary carrier bonding, debonding and detaping. The first unit has been delivered to a semiconductor manufacturer for panel-line integration.
The machine integrates temporary carrier bonding, debonding and detaping into one automated platform rated at 13 panels per hour, so panels move between process modules rather than between separate tools. ERS says that dual-carrier bonding and debonding workflows are increasingly important for backside processing in 3D IC, HBM and 2.5D IC packaging, and that the 310 × 310 mm panel format improves substrate-area utilisation compared with 300 mm circular wafers. The system is developed and manufactured at ERS’s Advanced Packaging facility in Barbing, Germany. The first unit has been delivered to a leading semiconductor manufacturer for integration into its panel production line. This listing records the announced system and first-unit delivery; it does not describe a broadly shipped product family beyond that statement.
Key characteristics associated with this technology.
310 × 310 mm panel-level packaging platform
Integrates temporary carrier bonding, debonding and detaping
13 panels per hour; in-tool module transfers instead of inter-tool moves
First unit delivered for integration into a manufacturer’s panel line
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