Discover 169 technologies from leading innovators around the world.
3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.
AI & HPCData Center+1View Technology
Infinity Fabric is AMD’s coherent on-package and multi-die interconnect, linking CPU core-complex dies to a central I/O die and, in multi-socket systems, across packages. Official EPYC architecture documents describe CCD–IOD GMI links and xGMI.
AI & HPCData Center+1View Technology
Apple Silicon is Apple’s fabless SoC platform. The M1 newsroom introduction defines a system-on-chip with CPU, GPU, Neural Engine, I/O and unified memory on a single package so those engines share one memory pool.
AI & HPCConsumer ElectronicsView Technology
22FDX is GlobalFoundries’ 22 nm fully depleted SOI platform: a thin-body transistor on an insulating layer, targeting low-power, RF, automotive and IoT designs that do not need leading-edge GAA.
AutomotiveConsumer Electronics+2View Technology
Filogic is MediaTek’s Wi-Fi 6/6E/7 connectivity platform for routers, gateways, access points and clients, with Multi-Link Operation, 320 MHz channels, 4096-QAM and dedicated NPUs on flagship access-point chips.
Consumer ElectronicsTelecommunications+1View Technology
FastConnect 7900 is a 6 nm single-chip connectivity system integrating Wi-Fi 7, Bluetooth and UWB, with High Band Simultaneous Multi-Link and companion RF front-end modules.
Consumer ElectronicsTelecommunications+1View Technology
Oryon is Qualcomm’s custom 64-bit CPU microarchitecture, including cache hierarchy, branch prediction, prefetch and later Flex Cache, designed in-house and scaled across Snapdragon platforms.
AutomotiveAI & HPC+2View Technology
Samsung’s 3 nm foundry node introduced Gate-All-Around transistors as Multi-Bridge-Channel FETs (MBCFET): stacked nanosheet channels with the gate on all four sides, replacing FinFET for better electrostatic control.
AutomotiveAI & HPC+2View Technology
Samsung V10 BV-NAND is bonded vertical NAND with more than 400 word lines, brought to mass-production readiness for AI storage.
AI & HPCData Center+1View Technology
Snapdragon X80 is Qualcomm's 5G Modem-RF system, combining the modem and RF front end, with 5G Advanced features and NB-NTN satellite support.
AutomotiveConsumer Electronics+1View Technology
Sony’s stacked CMOS image sensor separates the pixel die from the logic die and joins them with Cu-Cu hybrid bonding, replacing TSVs. Official technology pages describe Cu-Cu as enabling denser, smaller, higher-function sensors.
AutomotiveIndustrial+2View Technology
Micron 3D NAND is a vertically stacked NAND flash technology family used as the semiconductor storage building block in data-center, client, mobile and automotive designs.
AutomotiveAI & HPC+2View Technology
Micron LPDDR is a low-power DRAM family for mobile, client, automotive and data-center designs that need high bandwidth at reduced power. LPDDR generations remain one technology line.
AutomotiveAI & HPC+2View Technology
Micron GDDR is a discrete graphics DRAM family spanning GDDR6, GDDR6X and GDDR7 generations for GPUs, gaming systems and AI inference accelerators.
AI & HPCConsumer ElectronicsView Technology
KLA overlay and dimensional metrology systems measure layer-to-layer alignment, critical dimensions and related pattern geometry. Distinct from defect inspection and review.
AutomotiveData Center+1View Technology
ASML TWINSCAN DUV is the deep-ultraviolet lithography platform covering immersion and dry scanners that print most chip layers alongside EUV. Distinct from NXE and High-NA EXE EUV.
AI & HPCConsumer ElectronicsView Technology
Infineon CoolMOS is a high-voltage silicon superjunction MOSFET technology family for offline and high-voltage power conversion, distinct from CoolSiC, CoolGaN and OptiMOS.
Data CenterIndustrial+2View Technology
TSMC InFO is a wafer-level integrated fan-out packaging platform using high-density redistribution layers for mobile, network and high-performance computing integration.
AI & HPCConsumer Electronics+1View Technology
ASML TWINSCAN NXE is the 0.33 numerical-aperture EUV lithography platform used in high-volume manufacturing of advanced logic and memory chips. Distinct from High-NA EXE systems.
AI & HPCConsumer ElectronicsView Technology
Mindgrove Secure IoT is a RISC-V-based microcontroller/SoC family for connected and embedded devices, combining a processor core with peripherals, hardware crypto accelerators and on-chip secure memory.
IndustrialConsumer Electronics+1View Technology
Pragmatic FlexIC Platform Gen 3 is a flexible semiconductor technology platform using metal-oxide thin-film transistors on flexible substrates for mixed-signal integrated circuits supporting connect, sense and basic compute functions.
IndustrialConsumer Electronics+1View Technology
ASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.
AI & HPCData Center+1View Technology
Bosch MEMS sensor technology uses microelectromechanical structures to translate physical changes such as motion, pressure and environmental conditions into electrical information for compact sensing applications.
IndustrialConsumer Electronics+1View Technology
KLA wafer defect inspection and review systems used to find, classify and monitor particles and pattern defects. Distinct from overlay and dimensional metrology.
AutomotiveData Center+1View Technology
