MICROELECTROMECHANICAL SENSING STRUCTURES
Microelectromechanical sensing structures
Microelectromechanical sensing structures
Conversion of motion, pressure and environmental stimuli into electrical signals
Industrial · Consumer Electronics · IoT
Public source
Bosch Sensortec publishes MEMS sensor technology based on microelectromechanical systems that convert mechanical, magnetic or environmental changes into electrical signals.
Official product-family image
Bosch MEMS sensor technology uses microelectromechanical structures to translate physical changes such as motion, pressure and environmental conditions into electrical information for compact sensing applications.
Official pages describe sensing of pressure, motion, acceleration and related conditions, with use in compact consumer electronics such as smartphones, wearables and hearables, as well as other sensing applications. A MEMS device typically combines a mechanical sensing element with an evaluation circuit in a semiconductor package. This independent listing identifies the publicly described MEMS sensor technology rather than individual sensor part numbers. Device ratings and application guidance should be confirmed on Bosch Sensortec's current MEMS pages.
Key characteristics associated with this technology.
Microelectromechanical sensing structures
Conversion of motion, pressure and environmental stimuli into electrical signals
Compact sensing for consumer electronics, IoT and industrial uses
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