Technology Area
Microelectromechanical systems, sensors and related process capabilities.
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Technologies
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Companies
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Applications
MEMS and sensors are micromachined devices that sense motion, pressure, sound or other physical quantities, and in some cases actuate. Fabrication uses surface and bulk micromachining, wafer bonding and packaging that protects moving structures while exposing the sense environment.
Discover technologies, solutions and innovations in this area.
Bosch MEMS sensor technology uses microelectromechanical structures to translate physical changes such as motion, pressure and environmental conditions into electrical information for compact sensing applications.
IndustrialConsumer ElectronicsIoTView Technology
GalaxyCore GalaxyCell 2.0 is a CMOS image-sensor pixel-process platform using FPPI Plus and BDTI.
AutomotiveIndustrialConsumer ElectronicsView Technology
SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
AutomotiveData CenterTelecommunications+1View TechnologyKey application areas leveraging these technologies.
Technology area visuals are illustrative representations.
