PATTERNED AND UNPATTERNED
Patterned and unpatterned wafer defect inspection
Patterned and unpatterned wafer defect inspection
Optical and e-beam defect review and classification
Automotive · Data Center · Consumer Electronics
Public source
KLA publishes defect inspection and review systems for chip manufacturing, covering patterned and unpatterned wafer inspection plus optical and e-beam review.
Official technology image
KLA wafer defect inspection and review systems used to find, classify and monitor particles and pattern defects. Distinct from overlay and dimensional metrology.
Official product pages describe use in tool qualification, line monitoring and related yield applications, including cluster tools that inspect multiple wafer surfaces. The systems are presented as process-control equipment for finding and classifying defects rather than for measuring overlay or critical dimensions. Overlay and dimensional metrology is a separate KLA measurement family listed independently. Sensitivity, throughput and tool-model details should be taken from KLA’s current product documentation.
Key characteristics associated with this technology.
Patterned and unpatterned wafer defect inspection
Optical and e-beam defect review and classification
Process-control use across tool qualification and line monitoring
Distinct from overlay and dimensional metrology, which is listed separately
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