Discover 169 technologies from leading innovators around the world.
Blackwell is NVIDIA’s current data-center GPU architecture, built as a dual-die GPU with a 10 TB/s chip-to-chip interconnect. Official materials describe a two-reticle design manufactured on TSMC 4NP.
AI & HPCData CenterView Technology
BlueField is NVIDIA’s data processing unit: Arm cores, high-speed Ethernet/InfiniBand and hardware accelerators for networking, storage and security offload, isolated from the host CPU.
AI & HPCData CenterTelecommunicationsView Technology
Oryon is Qualcomm’s custom 64-bit CPU microarchitecture, including cache hierarchy, branch prediction, prefetch and later Flex Cache, designed in-house and scaled across Snapdragon platforms.
AutomotiveAI & HPCData Center+1View Technology
TPU7x (Ironwood) is Google Cloud's seventh-generation TPU, built for large-scale training and inference.
AI & HPCData CenterView Technology
Micron 3D NAND is a vertically stacked NAND flash technology family used as the semiconductor storage building block in data-center, client, mobile and automotive designs.
AutomotiveAI & HPCData Center+1
Micron LPDDR is a low-power DRAM family for mobile, client, automotive and data-center designs that need high bandwidth at reduced power. LPDDR generations remain one technology line.
AutomotiveAI & HPCData Center+1View Technology
Micron GDDR is a discrete graphics DRAM family spanning GDDR6, GDDR6X and GDDR7 generations for GPUs, gaming systems and AI inference accelerators.
AI & HPCConsumer ElectronicsView Technology
Lam Research SABRE is an electrochemical copper-deposition platform for damascene interconnect, including logic, memory and high-bandwidth memory wiring. Distinct from Lam’s broader etch category.
AI & HPCData CenterView Technology
Synopsys HBM interface IP is a high-bandwidth memory interface family including controller, PHY and verification IP for AI and high-performance computing SoCs. Distinct from UCIe die-to-die IP.
AI & HPCData CenterView Technology
Applied Materials Endura is an ultra-high-vacuum metallization platform used for physical vapor deposition and integrated multi-chamber sequences. Distinct from the Vistara wafer-manufacturing chassis.
AI & HPCData CenterView Technology
NVIDIA NVLink is a high-bandwidth GPU-to-GPU interconnect and rack-scale fabric for AI training and inference. Distinct from NVLink-C2C chip-to-chip packaging links.
AI & HPCData CenterView Technology
Intel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.
AI & HPCData CenterView Technology
Lightmatter Passage is a photonic interconnect platform using integrated photonics and three-dimensional connectivity approaches to scale high-bandwidth communication across advanced AI and computing systems.
AI & HPCData CenterView Technology
Ayar Labs TeraPHY is an optical I/O chiplet that combines silicon photonics with CMOS technology to provide high-bandwidth, low-latency chip-to-chip and package-to-package connectivity for large-scale computing systems.
AI & HPCData CenterTelecommunicationsView Technology
NVIDIA NVLink-C2C is a high-bandwidth coherent chip-to-chip interconnect for processors, accelerators and custom silicon inside a package. Distinct from NVLink GPU-to-GPU fabric.
AI & HPCData CenterView Technology
Micron high-bandwidth memory technology uses vertically stacked DRAM dies and high-density interconnects to provide high memory bandwidth and power efficiency for AI and data-center computing platforms.
AI & HPCData CenterView Technology
Cadence design platform for planning, implementing and analyzing 2.5D and 3D multi-die / chiplet systems.
AutomotiveAI & HPCData CenterView Technology
Synopsys die-to-die IP solution for Universal Chiplet Interconnect Express, including controller, PHY and verification IP.
AutomotiveAI & HPCData CenterView Technology
Modular semiconductor wafer-manufacturing chassis from Applied Materials for combining multiple chamber types on one system. Distinct from the Endura metallization platform.
AI & HPCData CenterView Technology
Intel Foundry 3D stacking and 2.5D chiplet packaging family, including hybrid-bonding options described as Foveros Direct 3D. EMIB is a separate 2.5D bridge platform.
AI & HPCData CenterConsumer ElectronicsView Technology
