Discover 169 technologies from leading innovators around the world.
Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
AlphaSGT is Alpha and Omega’s shielded-gate trench MOSFET technology, not a GaN HEMT and not a power-module substrate.
Arteris FlexNoC is on-chip network IP, not a packaged interconnect chip and not a coherent cache controller.
AXT VGF substrates are III-V wafers grown by vertical gradient freeze, not epiwafers and not finished RF chips.
GUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
Powerchip 3D AI Foundry is a wafer-on-wafer logic/memory stacking foundry offering, parked in Advanced Packaging because Foundry / Process does not yet exist.
Kokusai Batch ALD combines atomic-layer deposition with multi-wafer batch furnaces for 3D device films.
FormFactor composite-metal MEMS is a wafer-probe-card technology, not a MEMS sensor product.
Camtek Eagle is a wafer inspection and metrology equipment platform for BEOL, advanced packaging and related flows.
Rohm EcoGaN is a gallium-nitride power-device family, not a silicon MOSFET catalog.
Qnity Emblem is a next-generation CMP pad platform for advanced-node planarization, not a polishing tool.
Realtek Ethernet Total Solutions is a wired-connectivity PHY and controller platform, currently evidenced by live 2.5GbE product pages.
MACOM’s European Semiconductor Center publishes GaAs and GaN III-V foundry processes for microwave and mmWave devices.
Silergy’s integrated PMIC platform covers multi-rail power-management ICs, not discrete MOSFETs.
ASMPT LITHOBOLT G2 is a die-to-wafer hybrid-bonding system for direct and collective bonding.
SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
Nova’s multidisciplinary metrology platform combines optical scatterometry, X-ray and materials analysis for process control.
Aixtron Planetary Reactor is a batch MOCVD reactor architecture for compound-semiconductor epitaxy.
SUMCO Advanced Silicon Wafers are polished and specialty silicon starting substrates, including epitaxial, annealed and SOI wafers.
ACM Ultra C is a wet-clean and wet-process equipment family, not an IR homepage listing.
Alchip’s 2nm Design Platform is an ASIC physical-design methodology for 2nm compute dies and chiplet packaging, not a foundry process node.
The Dragonfly G5 System is Onto Innovation's advanced-packaging inspection and metrology system.
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
Coherent’s III-V epitaxial wafer platform supplies compound-semiconductor epi wafers for photonic and RF devices, not industrial laser systems.
