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Services & Manufacturing

Packaging

Assembly, substrates, and 2.5D/3D integration. A foundry process that mentions an interposer is still a foundry listing when the product is the wafer.

Showing 13–13 of 13 solutions.

  • VIPackASE Technology Holding logo

    Packaging

    ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.

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