NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
Samsung HBM4
Samsung HBM4 is a publicly named high-bandwidth memory device family for AI accelerators.
Overview
Samsung HBM4 is the company’s current high-bandwidth DRAM stack for AI accelerators, with an advanced base die and stacked DRAM cubes. Samsung’s official HBM family page covers HBM3E through HBM4/HBM4E as the AI-memory roadmap.
This listing records Samsung’s HBM4 stack technology rather than every HBM generation. HBM3 and HBM3E remain prior generations of the same family rather than separate listings. Micron High-Bandwidth Memory and Synopsys HBM Interface IP, already in the catalog, are a different vendor’s device and a PHY/controller IP block. Capacity options and interface details should be taken from Samsung’s current HBM documentation.
Technical capabilities
Positioned for AI accelerator and data-center platforms
Lifecycle and categories
- Lifecycle stages
- Memory and subsystem IP
Insights
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