Discover 169 technologies from leading innovators around the world.
Silergy’s integrated PMIC platform covers multi-rail power-management ICs, not discrete MOSFETs.
ASMPT LITHOBOLT G2 is a die-to-wafer hybrid-bonding system for direct and collective bonding.
SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
Nova’s multidisciplinary metrology platform combines optical scatterometry, X-ray and materials analysis for process control.
Aixtron Planetary Reactor is a batch MOCVD reactor architecture for compound-semiconductor epitaxy.
SCREEN SU Series is a single-wafer cleaning equipment family, currently described through SU-3400.
SUMCO Advanced Silicon Wafers are polished and specialty silicon starting substrates, including epitaxial, annealed and SOI wafers.
VeriSilicon SiPaaS is a platform-based custom-silicon design and turnkey service, not a foundry process node.
Skyworks Sky5 is a 5G RF front-end system platform, not a foundry process and not a baseband SoC.
SmartSens SmartClarity is a named CMOS image-sensor platform still published on official product series pages in 2026.
TrenchFET Gen V Power MOSFETs are Vishay's current published trench power-MOSFET generation.
ACM Ultra C is a wet-clean and wet-process equipment family, not an IR homepage listing.
Hwatsing Universal-H300 is a 300 mm chemical-mechanical polishing tool for integrated circuits, advanced packaging and silicon wafers.
Allegro XtremeSense TMR is a tunneling-magnetoresistance magnetic-sensing platform, not a Hall-only catalog.
The Dragonfly G5 System is Onto Innovation's advanced-packaging inspection and metrology system.
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
Coherent’s III-V epitaxial wafer platform supplies compound-semiconductor epi wafers for photonic and RF devices, not industrial laser systems.
eMemory NeoFuse is anti-fuse embedded OTP/PMTP silicon IP for logic process nodes, not a discrete memory product.
Technoprobe TPEG Vertical MEMS is a named probe-card technology for wafer test, not a finished tester or a MEMS sensor product.
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
Entegris Advanced Deposition Materials is a process-materials platform for precursor and deposition chemistries used in semiconductor manufacturing.
Texas Instruments analog BCD (LBC) is TI’s bipolar-CMOS-DMOS process identity for foundational analog and power silicon, described in official TI manufacturing communications.
Tokyo Electron CLEAN TRACK LITHIUS is a coater/developer track platform used with lithography tools in high-volume wafer fabrication.
DISCO DBG with DAF laser cut is a dicing-before-grinding process that laser-cuts die-attach film during wafer thinning.
