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LITHOBOLT G2

LITHOBOLT G2 is the hybrid-bonding generation published on ASMPT SEMI's product page.

Overview

ASMPT describes direct and collective die-to-wafer hybrid bonding, with standalone and cascade configurations.

Lifecycle and categories

Lifecycle stages
Packaging and chiplets

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NOV152026
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SC26

  • November 15 – 20, 2026
  • Chicago, Illinois, USA
  • Organized by SC Conference Series
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