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20 results for Manufacturing Equipment
ASM epitaxy is a crystalline film-growth equipment platform covering silicon and silicon-germanium transistor epitaxy and silicon carbide epitaxy. Distinct from ASM atomic layer deposition.
AutomotiveAI & HPCEnergyView Technology
Applied Materials Endura is an ultra-high-vacuum metallization platform used for physical vapor deposition and integrated multi-chamber sequences. Distinct from the Vistara wafer-manufacturing chassis.
AI & HPCData CenterView Technology
ASML TWINSCAN DUV is the deep-ultraviolet lithography platform covering immersion and dry scanners that print most chip layers alongside EUV. Distinct from NXE and High-NA EXE EUV.
AI & HPCConsumer ElectronicsView Technology
ASML TWINSCAN NXE is the 0.33 numerical-aperture EUV lithography platform used in high-volume manufacturing of advanced logic and memory chips. Distinct from High-NA EXE systems.
AI & HPCConsumer ElectronicsView Technology
ASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.
AI & HPCData CenterConsumer ElectronicsView Technology
Modular semiconductor wafer-manufacturing chassis from Applied Materials for combining multiple chamber types on one system. Distinct from the Endura metallization platform.
AI & HPCData CenterView Technology
Lam Research wafer-process equipment category for thin-film deposition, plasma etch, strip, clean and related fabrication steps. SABRE ECD is listed separately.
Data CenterConsumer ElectronicsView Technology
ASML High-NA EUV lithography platform (TWINSCAN EXE) using 0.55 numerical aperture optics. Distinct from 0.33 NA TWINSCAN NXE EUV systems.
AI & HPCConsumer ElectronicsView Technology
