THIN-FILM DEPOSITION PROCESS
Thin-film deposition process equipment, including CVD, PECVD and ALD
Thin-film deposition process equipment, including CVD, PECVD and ALD
Plasma etch, including RIE and atomic layer etch
Data Center · Consumer Electronics
Public source
Lam Research publishes a portfolio of wafer fabrication processes used to build semiconductor devices, with primary public categories covering thin-film deposition and plasma etch, plus related strip, clean and mass-metrology offerings.
Official product-family image
Lam Research wafer-process equipment category for thin-film deposition, plasma etch, strip, clean and related fabrication steps. SABRE ECD is listed separately.
Official process pages describe deposition methods such as CVD, PECVD and ALD, and etch methods including reactive ion etch and atomic layer etch for conductor, dielectric and high-aspect-ratio structures. This listing remains the broader etch and deposition process category rather than a single tool model. SABRE is Lam’s named electrochemical copper-deposition family and is listed independently. Tool configurations and process recipes remain with Lam Research.
Key characteristics associated with this technology.
Thin-film deposition process equipment, including CVD, PECVD and ALD
Plasma etch, including RIE and atomic layer etch
Related strip, clean and process-monitoring offerings described by the supplier
Distinct from the separately listed SABRE electrochemical deposition platform
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