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Silicon Showcase

Silicon Showcase™ is the global directory of semiconductor technologies, platforms and innovations from around the world.

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Explore Semiconductor Technologies

Discover 169 technologies from leading innovators around the world.

Technology Signals
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Photonics
Photonics

Marvell Coherent DSP

Marvell’s coherent DSP family is the silicon that encodes and decodes coherent optical wavelengths for long-haul, metro and data-center interconnect. Official product pages describe coherent DSPs as a core Marvell optical connectivity franchise.

Data CenterTelecommunications
View Technology
Compute & Accelerators
Compute & Accelerators

NVIDIA Blackwell Architecture

Blackwell is NVIDIA’s current data-center GPU architecture, built as a dual-die GPU with a 10 TB/s chip-to-chip interconnect. Official materials describe a two-reticle design manufactured on TSMC 4NP.

AI & HPCData CenterView Technology
Compute & Accelerators
Compute & Accelerators

NVIDIA BlueField DPU Architecture

BlueField is NVIDIA’s data processing unit: Arm cores, high-speed Ethernet/InfiniBand and hardware accelerators for networking, storage and security offload, isolated from the host CPU.

AI & HPCData CenterTelecommunicationsView Technology
Compute & Accelerators
Compute & Accelerators

Qualcomm Oryon CPU Architecture

Oryon is Qualcomm’s custom 64-bit CPU microarchitecture, including cache hierarchy, branch prediction, prefetch and later Flex Cache, designed in-house and scaled across Snapdragon platforms.

AutomotiveAI & HPCData Center+1View Technology
Memory & Storage
Memory & Storage

SK hynix HBM4

SK hynix HBM4 doubles I/O to 2,048 terminals, claims >10 Gbps and more than 40% better power efficiency versus the prior generation, and uses Advanced MR-MUF to stack DRAM with warpage control and heat dissipation.

AI & HPCData CenterView Technology
Foundry / Process
Foundry / Process

Samsung GAA MBCFET Process

Samsung’s 3 nm foundry node introduced Gate-All-Around transistors as Multi-Bridge-Channel FETs (MBCFET): stacked nanosheet channels with the gate on all four sides, replacing FinFET for better electrostatic control.

AutomotiveAI & HPCData Center+1View Technology
Memory & Storage
Memory & Storage

Samsung HBM4

Samsung HBM4 is the company’s current high-bandwidth DRAM stack for AI accelerators, with an advanced base die and stacked DRAM cubes. Samsung’s official HBM family page covers HBM3E through HBM4/HBM4E as the AI-memory roadmap.

AI & HPCData CenterView Technology
Memory & Storage
Memory & Storage

Samsung V10 BV-NAND

Samsung V10 BV-NAND is bonded vertical NAND with more than 400 word lines, brought to mass-production readiness for AI storage.

AI & HPCData CenterConsumer ElectronicsView Technology
Compute & Accelerators
Compute & Accelerators

TPU7x (Ironwood)

TPU7x (Ironwood) is Google Cloud's seventh-generation TPU, built for large-scale training and inference.

AI & HPCData CenterView Technology
Memory & Storage
Memory & Storage

Micron DDR DRAM

Micron DDR DRAM is a synchronous DRAM component family spanning successive double-data-rate generations for data-center, industrial and automotive designs.

AutomotiveData CenterIndustrialView Technology
Memory & Storage
Memory & Storage

Micron 3D NAND

Micron 3D NAND is a vertically stacked NAND flash technology family used as the semiconductor storage building block in data-center, client, mobile and automotive designs.

AutomotiveAI & HPCData Center+1View Technology
Memory & Storage
Memory & Storage

Micron LPDDR Memory

Micron LPDDR is a low-power DRAM family for mobile, client, automotive and data-center designs that need high bandwidth at reduced power. LPDDR generations remain one technology line.

AutomotiveAI & HPCData Center+1View Technology
Manufacturing Equipment
Manufacturing Equipment

Lam Research SABRE Electrochemical Deposition

Lam Research SABRE is an electrochemical copper-deposition platform for damascene interconnect, including logic, memory and high-bandwidth memory wiring. Distinct from Lam’s broader etch category.

AI & HPCData CenterView Technology
Design & IP
Design & IP

Synopsys HBM Interface IP

Synopsys HBM interface IP is a high-bandwidth memory interface family including controller, PHY and verification IP for AI and high-performance computing SoCs. Distinct from UCIe die-to-die IP.

AI & HPCData CenterView Technology
Power Semiconductors
Power Semiconductors

Infineon OptiMOS

Infineon OptiMOS is a low- and mid-voltage trench silicon MOSFET technology family for high-frequency power conversion. Distinct from CoolMOS, CoolSiC and CoolGaN.

AutomotiveData CenterIndustrial+1View Technology
Test & Inspection
Test & Inspection

KLA Overlay & Dimensional Metrology

KLA overlay and dimensional metrology systems measure layer-to-layer alignment, critical dimensions and related pattern geometry. Distinct from defect inspection and review.

AutomotiveData CenterConsumer ElectronicsView Technology
Manufacturing Equipment
Manufacturing Equipment

Applied Materials Endura PVD

Applied Materials Endura is an ultra-high-vacuum metallization platform used for physical vapor deposition and integrated multi-chamber sequences. Distinct from the Vistara wafer-manufacturing chassis.

AI & HPCData CenterView Technology
Compute & Accelerators
Compute & Accelerators

NVIDIA NVLink

NVIDIA NVLink is a high-bandwidth GPU-to-GPU interconnect and rack-scale fabric for AI training and inference. Distinct from NVLink-C2C chip-to-chip packaging links.

AI & HPCData CenterView Technology
Power Semiconductors
Power Semiconductors

Infineon CoolMOS

Infineon CoolMOS is a high-voltage silicon superjunction MOSFET technology family for offline and high-voltage power conversion, distinct from CoolSiC, CoolGaN and OptiMOS.

Data CenterIndustrialConsumer Electronics+1View Technology
Advanced Packaging
Advanced Packaging

Intel EMIB Advanced Packaging

Intel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.

AI & HPCData CenterView Technology
Advanced Packaging
Advanced Packaging

TSMC SoIC 3D Integration

TSMC-SoIC is a wafer-level frontend 3D chip-stacking platform for homogeneous and heterogeneous chiplets, distinct from CoWoS 2.5D packaging and InFO fan-out.

AI & HPCData CenterView Technology
Advanced Packaging
Advanced Packaging

TSMC CoWoS Advanced Packaging

TSMC CoWoS is a 2.5D advanced packaging platform that integrates logic dies and high-bandwidth memory on an interposer for high-performance computing and AI systems.

AI & HPCData CenterView Technology
Connectivity & RF
Connectivity & RF

FermionIC Multi-Protocol SERDES IP

FermionIC publishes multi-protocol SERDES semiconductor IP for high-speed chip-to-chip and system connectivity across advanced digital interfaces.

AI & HPCData CenterTelecommunicationsView Technology
Photonics
Photonics

Lightmatter Passage Photonic Interconnect

Lightmatter Passage is a photonic interconnect platform using integrated photonics and three-dimensional connectivity approaches to scale high-bandwidth communication across advanced AI and computing systems.

AI & HPCData CenterView Technology
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